摘要
圆片薄型化工艺技术的改进,以及对小型化、便携式产品的强烈的市场需求,共同推动了封装技术的创新。文中主要论述了与超薄型集成电路封装技术相关的薄型硅集成电路应用、超薄型圆片的制造、薄型化切割技术、同平面互连技术、倒装片装配及其可靠性问题。
Advancements in wafer thinning technologies, plus strong market demand for small, portable products, have combined to propel new packaging innovations. Applications for thin silicon ICs, fabrications of ultra-thin wafers, dicing by thinning, isoplanar interconnection, flip-chip assembly and reliability related to packaging for ultra-thin ICs have been stated in this paper.
出处
《电子与封装》
2006年第11期1-4,9,共5页
Electronics & Packaging
关键词
超薄型IC封装技术
超薄型圆片制造
薄型化切割技术
同平面互连
可靠性
packaging for ultra-thin ICs
fabrications of ultra-thin wafers
dicing by thinning
isoplanar interconnection
reliability
