摘要
低温共烧陶瓷LTCC基板是实现小型化、高可靠微波多芯片组件MMCM的一种理想的封装技术一文章对LTCC技术的特点及应用做出了评述,主要介绍国内外LTCC的现状、发展趋势与问题,同时突出强调了LTCC的飞速发展及对微波器件的重要性。
Low temperature co-fired ceramics （ LTCC ） substrate is an excellent packaging technique for achieving highly reliable and miniature microwave modules （ MMCM ）.The characteristics and applications of LTCC technology are reviewed. The current status, development trend and problems of LTCC are purposeful described at home and abroad. Meanwhile, from this article we can feel the LTCC is growing at a very fast speed and importance better microwave device.
出处
《电子与封装》
2006年第11期5-9,共5页
Electronics & Packaging
