硅通孔互连技术的开发与应用

Development & Applications of Through Wafer Interconnect Technology

随着三维叠层封装、MEMS封装、垂直集成传感器阵列以及台面MOS功率器件倒装焊技术的开发,硅通孔互连技术正在受到越来越广泛的重视和研究。文中叙述了几种硅通孔互连技术的制造方法,以及它们在三维封装、MEMS封装、高密度硅基板、垂直集成传感器阵列和台面MOS功率器件等方面的应用。最后,进一步阐述了硅通孔互连中几项关键技术的研究现状以及存在的挑战。

With the development of 3D packaging, MEMS packaging, vertical integrated sensor array and flip chip CSP for vertical power MOSFET, through wafer interconnect technology has been widely emphasized and researched. This paper described several fabrication methods of through wafer interconnect and their applications Finally, the status and challenges of several key through wafer interconnect are further introduced.