电子组装业钎接材料的发展

The development of soldering materials of electronic assembly industry

ＣＦＣ的禁用使得钎接材料制造商把重点放在水洗钎剂和免洗钎剂的研究。考虑到这两种钎剂的可靠性，现行的测试标准必须作相应的修改，新型钎剂的使用要配合新的组装工艺和设备，其中比较有生命力的是氮气保护钎接工艺。细节距ＳＭＤ越来越多的使用，推动了钎膏的发展，更深入地理解钎膏的流变性，有利于更好地控制钎膏的印刷性能。解决汽相焊中易于出现的虹吸问题。

The prohibition of CFC solvents has forced soldering materials manufactruers to focus on the research and development of watersoluble and no-clean soldering materiats.As the reliability of the new developed soldering materials being considered, current testing specifications must be revised. New processes and equipmenst are needed for fulfilling the applications of these new materials, among them, the nirtogen atmosphere soldering process is the most prospective. The development of solder paste has been initiated by the application of more and more fine pitch SMD. In order to improve the performances of solder paste, it is necessary to understand the reology more deeply. A two part solder paste is effective for avoiding the solder wicking problem in vapor phase soldering process.