摘要
采用水冷、空冷和炉冷的不同冷却方式，对焊点的热循环寿命进行了初步研究，结果表明，对ＳｎＰｂ６０／４０钎料，空冷焊点的热循环寿命最高，水冷的最差。焊点的断面均是沿晶和穿晶的混合断口，并伴有疲劳辉纹。
The thermal fatigue life of solder joints with different cooling rate has been studied.It showes that air-cooling solder joints have the longest fatigue life, while water-cooling solder joints have the shortest. Fracture surface showes creep-fatigue interaction characteristios,i.e.both intergranular crack and fatigue stripe are on it.
出处
《电子工艺技术》
1996年第4期12-14,共3页
Electronics Process Technology
