摘要
报道了一种弱相于激光干涉测温方法.以1.3μmInGaAsP半导体激光为微探针.实时测量了功率晶体管内部结点的瞬态热特性,该方法具有响应速度快、完全非侵人性、空间分辨率高、测温范围广等优点,适合于测试Si、GaAs、InP等材料的功率电子和光电子器件的瞬态热特性.
A low-coherence laser interferometry has been proposed to measure temperature of power devices. The transient thermal characteristic in power transistors has been measured in real time with a InGaAsP LD used as a microprobe. The experimental results show that this method is accurate and noninvasive. It also has the advantages of high spatial resolution, quick response speed, and a wide measuring range. It is applicable to power electronics and optoelectronics devices fabricated with Si, GaAs, and InP materials.
出处
《中国激光》
EI
CAS
CSCD
北大核心
1996年第12期1087-1090,共4页
Chinese Journal of Lasers
基金
国防预研基金
关键词
功率器件
激光探针
无损测试
半导体器件
laser interference thermometry, thermal measurement, power device thermal analysis