MEMS器件的封装材料与封装工艺

Package Materials and Processes of MEMS Devices

随着各种MEMS新产品的不断问世,先进的MEMS器件的封装技术正在研发之中。本研究综述了MEMS的封装材料,包括陶瓷、塑料、金属材料和金属基复合材料等。阐述了MEMS的主要封装工艺和技术,包括圆片级封装、单芯片封装、多芯片组件和3D堆叠式封装等。并展望了MEMS器件封装的应用和发展前景。

With continuous invention of various new products of MEMS, advanced package technologies of MEMS are being researched and developed. Account of package materials of MEMS, including ceramics, plastic, metal material and metal compound material, etc was given. Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3D packaging, etc were discussed. The applications and future developments of MEMS package were prospected.