电路板的塞孔与网印

Hole Clogging fro PCB and Scren Print-ing

随着电子事业的飞速发展和整机的短、薄、轻、小的要求,电路板也日益趋向线路高密度化和孔径的减小。SMT、BGA技术的发展,尤其是引脚密度的增加,对元器件的安装提出了更高的要求,因产品的差异和技术要求的多样性及不同的贴装工艺,对塞孔工艺要求越来越高。对塞孔工艺的现状进行了概述,供业内及周边技术领域参考。

With the rapid development of electronic industry and the requirements of weight, size and thickness for the main body, PCB tends to high density circuit and small aperture. Alongside the growth of SMT and BGA, especially the increasing density, a still higher demand for elements mounting is set. The requirements for hole clogging process get more rigorous. This article introduces the status of hole clogging for reference.