摘要
(Pb1-xSrx)TiO3系铁电材料是一种互溶性较好的钙钛矿材料,本文采用磁控溅射法,在Si基底上成功地制备了结构致密、性能优良的PST铁电薄膜,其制备工艺可与Si微电子技术兼容。性能测试表明,其介电常数可达900,接近10^3量级,介电损耗较低,约在0.12-0.21之间(-10℃至60℃)。铁电性能也较好,其饱和极化强度可接近10μC/cm^2,矫顽场强约21kV/cm。
(Pb1-xSrx)TiO3(PST)ferroelectric thin films with good microstructures and characteristics were prepared successfully by magnetron sputtering. The PST thin films were compatible with the Si microelectronics fabrication. Its dielectrie constant can attain 900 and its dielcctrlc loss is low(about 0.12-0.21 between - 10℃to 60℃) .The saturation polarization intensity P, is near 10μC/cm^2 and Ec is about 21 kV/cm.
出处
《真空科学与技术学报》
EI
CAS
CSCD
北大核心
2006年第6期522-525,共4页
Chinese Journal of Vacuum Science and Technology
基金
国家自然科学基金(No.69671008)
教育部光电技术及系统重点实验室资助课题(No.CETD00-09)
关键词
(Pb1-xSrx)TiO3薄膜
磁控溅射
介电性能
铁电性能
(P1-xSrx ) TiO3 thin films, Magnetron Sputtering, Dielectric characteristics, Ferroelectric characteristics