摘要
通过示差扫描量热法分析(DSC)研究了芳香胺改性双氰胺/环氧树脂E-44体系的固化反应,并探讨了反应的机理。结果表明,芳香胺改性双氰胺对环氧树脂E-44具有较高的固化反应活性,反应表观活化能明显降低,固化反应可以在中温进行。其固化反应机理与未改性的双氰胺环氧体系不同。
Curing reaction and mechanism of epoxy resin E - 44/dicyandiamide modified by aromatic amine system were studied by differential scanning calorimetry （DSC）. The experimental results showed the modified dicyandiamide had excellent curing characteristic for epoxy resin E - 44, and apparent activation energy of curing reaction was decreased appreciably, and curing reaction could be carried out at moderate temperature. Its curing reaction mechanism was different with common dicyandiamide/epoxy resin E - 44.
出处
《热固性树脂》
CAS
CSCD
2006年第6期11-13,共3页
Thermosetting Resin
关键词
改性双氰胺
芳香胺
环氧树脂
动力学
modified dicyandiamide
aromatic amine
epoxy resin
kinetics
