单晶铜线材载流摩擦磨损行为研究

Wear Behavior of Single Crystal Copper Conducting Wire under Electrical Current

在经改制过的MS-T3000摩擦磨损试验机上，以黄铜为摩擦副，对热型连铸技术制备的单晶铜进行栽流摩擦磨损试验，研究了电流对单晶铜导线栽流摩擦磨损行为的影响。结果表明：电流强度对单晶铜干摩擦磨损行为有显著影响。电流在0～15A范围内，随着电流的增加，摩擦系数与磨损率变化基本一致，呈现先减少后增加的趋势。电流较小时，接触电阻也比较小且较稳定；电流高时，接触电阻比较大，波动剧烈，而且有电弧出现。单晶铜导线在带电条件下的主要磨损形式为磨粒磨损、粘着磨损以及以电化学作用为主的氧化磨损或腐蚀磨损。

The friction and wear behavior of single crystal copper conducting wire against brass block was investigated. Wear tests were conducted under laboratory conditions with a sliding friction and wear apparatus that simulated train motion under electrical current conditions. The results indicated that the electrical current intensity has a notable effect on the friction and wear behavior of single crystal copper conducting wire. Within the studied range of electrical current, with electrical current increasing, friction coefficient and wear rate decrease at first, reach their minimum, then increase. Moreover, contact resistance and frequency of electric arc arising increase. Adhesive, abrasive, oxidative, and electrical erosion were the dominant mechanisms during the electrical sliding processes.