摘要
随着深亚微米设计的发展,互连线串扰变得更加严重。文中分析了深亚微米集成电路设计中对两相邻耦合RC互连串扰的成因,论述了在设计中抑制串扰一般方法。
The development of submicron designs has worsened the problem of interconnect crosstalk. This paper presents the causes of crosstalk between tow neighboring coupled RC interconnects in submicron integrated circuit design and discusses its control.
出处
《电子科技》
2006年第12期11-13,24,共4页
Electronic Science and Technology
关键词
互连
信号完整性
串扰
interconnect
signal integrity
crosstalk
