摘要
根据镓合金低熔点的特性,利用组合二元相图法模拟了Ga-Ag-Sn三元相图,由此确定了Ga-Ag-Sn液态合金的合理配料区间。对Ga-Ag-Sn液态合金与无氧铜的界面进行了SEM和EDS研究,初步研究结果表明:Ga95.0Ag0.195Sn液态合金能与无氧铜基体发生互扩散,并形成致密且与基体结合良好的Ga-Ag-Sn/Cu界面层,从而起到真空修复作用。
According to the low melting point characteristic of gallium alloy, the Ga-Ag-Sn liquid state alloy reasonable ingredient sector was determined by means of dual phase diagram method. The interface between the Ga-Ag-Sn liquid state alloy and copper was researched by SEM and EDS. The preliminary experimental results indicate that Ga95.0Ago.195Sn liquid state alloy can be able to diffuse with copper and form a compacted Ga-Ag-Sn/Cu interphase which have a good combination with copper substrate and functioned as vacuum repair.
出处
《有色金属（冶炼部分）》
CAS
北大核心
2006年第6期42-45,共4页
Nonferrous Metals（Extractive Metallurgy)
基金
国防科工委基金资助项目
南京工业大学引进人才科研启动基金项目(51303021)
