Ti_3SiC_2陶瓷颗粒表面超声波化学镀铜

Ultrasonic Electroless Copper Plating on the Surface of Ti_3SiC_2 Particles

钛碳化硅(Ti3SiC2)陶瓷导电材料有许多优异的性能,其摩擦系数甚至比石墨更低,完全可以取代石墨用来制备性能更加优良的铜基电接触复合材料,但是由于其与铜基体之间的浸润性不是很好,研究了利用超声波化学镀覆技术在Ti3SiC2颗粒表面均匀镀上一层连续的铜镀层。通过扫描电子显微镜对铜镀层表面形貌的观察表明:通过严格的镀前预处理工艺的优化设计以增加活化点,对传统镀液配方的调整以降低镀速,能够成功的在Ti3SiC2颗粒表面均匀镀覆一层铜微粒,改善了Ti3SiC2和铜基体间的润湿性,从而增强二者之间的界面结合力。

Titanium silicon earbide（Ti3SiC2）ceramic material has excellent electrical and thermal conductivity, high strength, good oxidation resistance and thermal shock resistance and self-lubricating property, its friction coefficient is even lower than graphite,so we can use it to replace graphite to produce copper matrix composites which possess more excellent properties. Though the wetting property between copper matrix and Ti3SiC2 is poor,the technology that produces complex powder Ti3SiC2/Cu through ultrasonic electroless copper plating was adopted. SEM images show that the optimum process before electroless plating aimed to add activated sitea,and the adjustment of the traditional composition of copper electroless plating bath can decelerate the velocity of electroless plating. The surface of Ti3SiC2 was successfully coated with continuous copper , so that the interfacial strength between Ti3SiC2 and copper matrix was increased. KEY WORDS：