摘要
对覆铜板导热性能评价方法进行了比较,提出了一种通过模拟发热元件贴装在线路板进行导热型覆铜板热阻测量的新方法。实验测试表明,该方法原理简单,易于操作,而且测试精度较高,是对覆铜板性能测试方法的一个补充,具有较大的推广应用价值。
The thermal conductivity and the test methods of copper clad laminate are introduced and analysed in this paper, a new test method of thermal resistance is proposed through simulating a power electronic element mounted on PCB. it is proved by experiment that the principle is reasonable, operation is easy and the result is exact.
出处
《绝缘材料》
CAS
2006年第6期62-64,共3页
Insulating Materials
关键词
覆铜板
热阻
测量
copper clad laminate
thermal resistance
test method
