超级计算机机箱的热流场特性研究和优化设计

Thermal Simulation and Design Optimization for a Supercomputer Chassis

采用计算流体力学(CFD)方法研究机箱在强制对流条件下的流场和热场特性。对影响机箱温度的元件布局、平板散热器结构、气流通道净空间距、环境温度等因素进行了研究和优化,获得了芯片温度对翅间距、翅厚、风道净空间距、环境温度的量化依赖关系;总结出了以上参数的优化值以及平板散热器翅间距和翅厚设计的经验值范围。

Thermal performance of a supercomputer chassis was simulated by CFD （ Computational Fluid Dynamics） method. The significant variables such as the chip arrangement, structure of plate heat sink, clearance space of airduct, ambient temperature are studied and optimized. The dependencies of chip temperatures on fin-pitch, fin-thickness, clearance space of airduct and ambient temperature are derived. Finally the optimal values of above parameters are presented as well as the empirical value ranges of fin-pitch and fin-thickness.