集成电路引线框架的热性能分析

Thermal Analysis of Integrated Circuit Lead-Frame

介绍了AutoTherm软件热分析流程,通过仿真分析了集成电路封装中引线框架的形状、厚度、材料等参数对集成电路热性能的影响,提出了设计具有良好导热性能引线框架的条件,即尽量选用导热系数大的合金材料做引线框架.

After introduction of the heat analysis flow in AutoTherm software, the packaging thermal effect on integrated circuit is analyzed. The simulation results show that parameters such as material, shape anti the thickness of the lead-frame have immediate effects on the thermal performance. The detailed analyses indicate that a necessary condition of designing the lead-frame with good thermal performance is that the lead-frame shnuhl be made of alloy materials with large thermal conductivity.