符合RoHS禁令的厚膜金导体浆料

Performance of RollS Compliant Thick Film Gold Conductor

出于对健康和环境的考虑，限制铅、镉和含有其它有毒物质在混合集成电路产品应用的需求越来越大。根据2006年7月1日生效的欧盟禁令（即RoHS）这些物质是禁用的，电路生产商急于找到可以替换现有舍铅和镉的产品。镉氧化物在厚膜佥浆料中可以起到很好的粘附作用。金厚膜浆料主要用于要求高机械强度的领域，比如医疗器械，军事应用和高频电路。现在的挑战是开发一新的和传统的含镉浆料具有相同性能的无镉导体金浆料。在过去的10年中．贺利氏超前地研发了无铅无镉厚膜产品。到目前，贺利氏已经开发并且打入一些环保型厚膜产品市场。 讨论一种新开发的厚膜导体金浆料．给出了在96％氧化铝基板和绝缘体基板上分别焊接金线和铝线的线键合数据。数据显示无铅无镉金导体和RoHS规定的可锡焊导体之间的匹配性．结果表明它可以应用于混合金属电路。

There is an increased demand from the electronic and hybrid circuit manufactures to restrict the use of lead and cadmium and other hazardous substances from their products due to health and environmental issues. With the pending implementation of the European Union directive （Restriction of Hazardous Substances） banning the use of these substances, effective 1 July 2006, circuit manufacturers are eager to find replacements for their existing materials which contain lead and cadmium. It is well documented that cadmium oxide is an excellent adhesion promoter in thick film gold paste. Gold thick film pastes are primarily used in high reliability applications such as medical devices, military applications and high frequency circuits. The challenge is to develop a gold conductor formulation with the same performance and properties as classic cadmium containing formulations. Heraeus has been proactive for the past decade in the development of thick film products that are both lead and cadmium free. To date, Heraeus has developed and introduced into the market many environmentally friendly thick film products. This paper discusses the results of a newly developed thick film gold conductor paste for use in a wide variety of applications. Wire bonding data will be presented, with both gold and aluminum wire, on top of both 96% Al2O3 and dielectric substrates with reliability results. Data will show compatibility between the lead and cadmium free gold conductor and a variety of RollS compliant solderable conductors to allow for its use in mixed metallurgy circuits.