摘要
平行封焊是微电子器件封装过程中的最后一道工序,封焊质量的好坏对产品的合格率有很大的影响,为了提高焊接质量,进而提高平行封焊设备的性能,研究平行封焊工艺显得至关重要。
The parallel seam sealing is a process of the last device packaging processes. The quality of welding has an effect on the pass rate of products. In order to enhance the quality of welding and to improve the performance of parallel seam equipments, the research of parallel seam sealing technology is particularly important.
出处
《电子工业专用设备》
2006年第12期47-49,共3页
Equipment for Electronic Products Manufacturing
关键词
平行封焊
工艺
检漏
Parallel
Seam
Sealing process monitor
