摘要
在新设计的非金属化学镀铜溶液中,通过考察各个因素对沉积速度和镀液稳定性的影响,确定了新的镀铜工艺。新工艺以次亚磷酸钠代替甲醛作还原剂,以复配的具有催化活性作用的Cu^(2+)和Ni^(2+)作催化剂,镀速快、无毒、铜膜层致密光亮、镀液更稳定,完全优于以甲醛为还原剂的化学镀铜技术。
A completely new technology of electroless copper plating in the redesigned nonmetallic electroless copper plating solution was developed. The influence of various factors on the depositing speed and stability of the solution was studied. Using hypophosphite as reducing agent replacing formaldehyde and mixed active Cu^2＋ and Ni^2＋ as catalyst, the new technology has excellent performonce such as high speed, no toxin, compact and lucent plating, steady solution, is superior to the common copper plating technology.
出处
《腐蚀与防护》
CAS
北大核心
2006年第12期642-644,共3页
Corrosion & Protection
关键词
非金属
化学镀
化学镀铜
Nonmetal
Electroless plating
Electroless copper plating
