场发射金属尖阴极阵列的制备

Fabrication of the Metal TiP Cathode Arrays for Field Emission

本文采用ＳｉＯ２作锥尖的塑模，再利用塑模制备出场发射金属尖阴极阵列，并给出ＳＥＭ金属尖照片，分析了工艺因素对金属尖的影响。

This paper uses SiO 2 for the cusp molding technology and then the metal tip cathode arrays for the field emission are fabricated. The SEM photographs are presented and the influence of the technology factors on the metal tip are analized.