小体积高压电源的固体封装技术

Solid state encapsulation technique of small volume high voltage power supply

本文介绍了一种小体积高压电源固体封装技术要点.给出了有关试验数据,指出小体积高压电源的封装技术是工艺、结构、电路三方密切配合的结果.采用这项新技术,可以有效地缩小电源体积,避免高压电源(组件)在湿热环境或低气压下产生电晕、飞弧;或者因电晕产生过载致使某些元件损坏,从而提高部件的可靠性.

This paper introduces the solid-slate encapsulation technique of small volume high-voltage power supply. experimental data are given, and it is pointed out that encapsulation technique is the result of technology, struetual and eireuit combination togelher. The new Technique may reduce effectively volume of power supply and avoid high-votage power supply (components) to generate corona, are under the humid heat atmosphere and low pressure, thus some elements are damaged by corona. Therefore, reliability of components is ihereased.