网孔状地参考面上高速互连的信号完整性分析

Analysis of Signal Integrity of High-Speed Interconnects on Meshed Ground Plane

本文主要基于实验研究,并结合三维全波电磁和电路系统仿真在频域和时域对高速多层PCB板中网孔状接地层或电源层上高速互连的信号完整性性能进行了测试和仿真分析,并对网孔状地参考面的周期性结构所呈现的频率带通(带阻)特性进行了理论分析.指出,参考面中的网孔会对跨越网孔的信号线传输特性产生较大扰动,甚至在信号频谱范围内产生局部的阻带,影响高速信号传播.最后,给出了网孔状地参考面高速互连的设计规则.

The signal integdty（SI）of high-speed interconnects on meshed ground/power reference plane in high-speed multilayer PCB is investigated both by measurement and simulation. The analysis is mainly based on experimental measurement which incorporated 3D Rill-wave EM and circuit and system simulation in frequency and time domain. The frequency characteristics of bandpass（band-stop）is theoretically analyzed which caused by the periodic structure of the meshed ground plane.The results arc shown that the transmission characteristics of signal lines across the meshes arc largely affected by the meshes on the reference plane. Even the band-stop can appear in the frequency ranges of the transmission signal in part, which can degrade the quality of high-speed signal.Finally,the design rules for high-speed interconnects on the meshed ground plane arc derived from the results obtained.