期刊文献+
任意字段
题名或关键词
题名
关键词
文摘
作者
第一作者
机构
刊名
分类号
参考文献
作者简介
基金资助
栏目信息

LTCC 450 MHz CDMA功放模块的研制

The Development of 450 MHz LTCC Power Amplifier Module for CDMA Mobile Phone
下载PDF
导出
摘要 对LTCC埋层电感进行了研究,以研制体积小、低损耗、微波性能好的高密度功放模块。利用商用三维电磁场分析软件HFSS对LTCC集成化功率放大器PA组装和互连中的关键参数进行了仿真和优化。研制出450MHzCDMA手机LTCC功率放大器,增益29.0dB,VSWR为2.0∶1,PAE为34%,体积为6mm×6mm×1.2mm。 In order to develop high density power amplifier（PA） with small volume, low cost, and high performance, the LTCC embedded inductor was studied in this paper. Some critical parameters of packaging and interconnection of the LTCC integrated PA were simulated and optimized by using commercial 3D electromagnetic field analysis software HFSS. The gain, VSWR and the power added efficiency of the 450 MHz power amplifier module for CDMA mobile phone are 29dB, 2 ： 1, and 34%, respectively. The volume of the PAM is only 6 mm×6 mm×1.2 mm.
作者 许庆 吴健 杨磊 钱峰 王子良 戴雷
机构地区 南京电子器件研究所
出处 《固体电子学研究与进展》 CAS CSCD 北大核心 2006年第4期477-480,共4页 Research & Progress of SSE
关键词 低温共烧陶瓷 功率放大模块 HFSS low temperature co-fired ceramic（LTCC） power amplifier module HFSS
分类号 TN722.7 [电子电信—电路与系统]
  • 相关文献

参考文献6

  • 1Kim Erick,Lee Young-Shin,Yoo Chan-Sei,et al.A power amplifier module with fully embedded passive components in LTCC substrate for K-PCS band mobile phone[C].23rd European Microwave ConferenceMarch 2003,1:253-256.
  • 2Leung W Y,Cheng K K M,Wu K L.Multi-layer LTCC bandpass filter design with enhanced stop-band characteristics[J].IEEE Microwave & Wireless Components Letters,2002,12 (7):240-242.
  • 3严伟,洪伟,薛羽.低温共烧陶瓷微波多芯片组件[J].电子学报,2002,30(5):711-714. 被引量：23
  • 4Yeung L K,Wu K L.A compact second-order LTCC band-pass filter with two finite transmission zeros[J].IEEE Trans Microwave Theory Technol,2003,51(2):337-341.
  • 5Chang Kai.Handbook of RF/microwave components and engineering[M].Published by John Wiley & Sons,Inc,Hoboken,New Jersey,2003:1711-1752.
  • 6Sutono Albert,Heo Deukhyoun,Chen Yi-Jan Emery,et al.High-Q LTCC-based passive library for wireless system-on-package (SOP) module development[J].IEEE Transaction on Microwave Theory and Technique,2001,49 (10):1715-1724.

二级参考文献6

  • 1[1]D Richard Decker,Ramani Tatikola,Narayan Rangappa Mysoor.Multichip MMIC package for X and Ka bands [J].IEEE Transactions on MTT,February 1997,20(1):27-32.
  • 2[2]Mark S Hauhe,John J Wooldridge.High density packaging of X-band array modules [J].IEEE Transactions on CPMT,August 1997,20(3):279-291.
  • 3[3]D Sturzebecher,J Leen,R Cadotte,etc.20GHz LTCC Phased Array Module [M].IEEE MT T-S Digest,1996:991-994.
  • 4[4]George E Ponchak,Donghoon Chen,Jong-Gwan Yook,Linda P B Katehi.Characterization of Plated Via Hole Fences for Isolation Between Stripline Circuits in LTCC Pack ages [M].IEEE MTT-S Digest,1998.1831-1834.
  • 5[5]A Pham,A Sutono,J Laskar,V Krishnamurthy,H S Cole,T Sitnik-Nieters.Development of Millimeter Wave Multi-layer Organic Based MCM Technology [M].IEEE MTT-S D igest,1998.1103-1106.
  • 6[6]Hiroshi Uchimura,Takeshi Takenoshita,Mikio Fujii.Development of a laminated wave guide [J].IEEE Transactions on Microwave Theory and Techniques,1998,46(12):243 8-2443.

共引文献22

固体电子学研究与进展
2006年 第4期

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部