超薄型圆片级芯片尺寸封装技术

Ultrathin Wafer Level Chip Size Package Technology

ShellCase公司的圆片级封装技术工艺,采用商用半导体圆片加工设备,把芯片进行封装并包封到分离的腔体中后仍为圆片形式。圆片级芯片尺寸封装(WL-CSP)工艺是在固态芯片尺寸玻璃外壳中装入芯片。玻璃包封防止了硅片的外露,并确保了良好的机械性能及环境保护功能。凸点下面专用的聚合物顺从层提供了板级可靠性。把凸点置于单个接触焊盘上,并进行回流焊,圆片分离形成封装器件成品。WL-CSP封装完全符合JEDEC和SMT标准。这样的芯片规模封装(CSP),其测量厚度为300μm-700μm,这是各种尺寸敏感型电子产品使用的关键因素。

The ShellCase company wafer-level packaging process uses commercial semiconductor wafer processing equipment. Dies are packaged and encapsulated into separate enclosures while still in wafer form. This wafer level chip size package （WL-CSP） process encases the die in a solid die-size glass shell. The glass encapsulation prevents the silicon from being exposed and ensures excellent mechanical and environmental protection. A proprietary compliant polymer layer under the bumps provides on board reliability. Bumps are placed on the individual contact pads, are refiowed, and wafer singulation yields finished packaged devices. The WL-CSP fully complies with joint electron device engineering council （JEDEC） and surface mount technology （SMT） standards. Such chip scale packages （CSPs） measure 300 μ m-700 μ m in thickness, a crucial factor for use in various size sensitive electronic products.