摘要
随着电子产品小型化、无铅化的发展,对焊接材料提出了更高的要求。无铅钎料Au80Sn20由于具有优良的力学性能,在高可靠性气密封装和芯片焊接中被广泛应用。综述了近几年来Au80Sn20的发展状况,重点介绍了该焊料的可靠性研究。
With the miniaturized and lead-free development of electronic products,higher demand is put forward about sohter.Leadfi＇ee solder Au80Sn20 is widely applied in high reliable hermetic package and die wehling due to excellent mechanical properly.The text summarizes the development slatus of Au80Sn20 in recent several years,and emphasizes to introduce the reliability study of the solder.
出处
《电焊机》
2006年第11期14-19,共6页
Electric Welding Machine
基金
国家自然科学基金(50575160)
博士点基金(20050056035)
