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Electrical Properties of Plasma Deposited Low-Dielectric-Constant Fluorinated Amorphous Carbon Films

Electrical Properties of Plasma Deposited Low-Dielectric-Constant Fluorinated Amorphous Carbon Films
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摘要 Fluorinated amorphous carbon (a-C:F) films were deposited at room temperature using C4Fs and CH4 as precursor gases by electron cyclotron resonance chemical vapour deposition (ECR-CVD). Chemical structures were analysed using X-ray photoelectron spectroscopy (XPS). The current conduction shows ohmic behaviour and the leakage current increases with the content of C sp2 in the deposited a-C:F films at a low electric field. The behaviour of the leakage current is well e^plained by the Poole-Frankel mechanism at a high electric field. The interface traps, rather than chemical structures, of a-C:F films determine the PF emission current. Fluorinated amorphous carbon (a-C:F) films were deposited at room temperature using C4Fs and CH4 as precursor gases by electron cyclotron resonance chemical vapour deposition (ECR-CVD). Chemical structures were analysed using X-ray photoelectron spectroscopy (XPS). The current conduction shows ohmic behaviour and the leakage current increases with the content of C sp2 in the deposited a-C:F films at a low electric field. The behaviour of the leakage current is well e^plained by the Poole-Frankel mechanism at a high electric field. The interface traps, rather than chemical structures, of a-C:F films determine the PF emission current.
出处 《Plasma Science and Technology》 SCIE EI CAS CSCD 2006年第6期724-726,共3页 等离子体科学和技术(英文版)
基金 supported by the Key Laboratory Foundation of Electron Devices Reliability Physics and Applications(No.51433020205DZ01) the Xi'an Applied Materials Innovation Fund(No.XA-AM-200501)
关键词 electrical properties conduction behaviour chemical vapour deposition a-C:F electrical properties, conduction behaviour, chemical vapour deposition, a-C:F
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