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基于LTCC多层基板的X波段T/R组件小型化设计 被引量:11

Design of X Band Small-size T/R Module Based on LTCC Substrate
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摘要 介绍了一种适用于星载X波段相控阵雷达T/R组件的设计,新兴的LTCC多层基板技术为其小型化和轻型化提供可能。详细讨论了组件结构、装配工艺及电磁兼容优化设计,其中包括微波电路布局、接地层参数优化设计和多芯片组件的键合互连技术等。最后,给出了小尺寸轻型试验样件的实测参数,单只组件体积仅为75×22×10 mm3,重量仅为37 g,组件输出功率大于6 W。 A T/R Module suitable for space- borne active phased array radar operating in X - Band has been presented. The developed LTCC substrate provides its lowest mass and size possible. The paper has discussed in detail the module architecture, the assembly technology,and the optimum EMC design, which includes the microwave circuit layout, the parameter design for ground- layer,the bonding interconnect of MCM and so on. Finally,an extract of measurement results coming from a T/R Module test lot has also been given. A power level of 6 Watts is available at the antenna port, with a very compact module size of 75×22× 10 mm^3 and an extremely low weight of less than 37 grams.
出处 《现代电子技术》 2007年第1期55-57,共3页 Modern Electronics Technique
基金 国家高技术研究发展计划(2003AA782041)
关键词 T/R组件 低温共烧陶瓷基板 小型化设计 电磁兼容 T/R module LTCC substrate small - size EMC
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  • 1Simon W, Kulke R, Wien M, etc. Interconnects and Transitions in Multilayer LTCC Multichip Modules for 24 GHz ISM—Band Applications. 2000 IEEE MTT-S Digest: 1047~1050.
  • 2Steve Nelson, Marilyn Youngblood, Jeanne Pavio,etc. Optimum Microstrip Interconnects. 1991 IEEE MTT-S Digest: 1071~1074.
  • 3Steven L March. Simple Equations Characterize Bond Wires. Microwaves & RF, 1991:105~110.
  • 4Alimenti F, Goebel U, Sorrentino R Quasi Static Analysis of Microstrip Bondwire Interconnects. 1995 IEEE MTT-S Digest: 679~682.
  • 5严伟,洪伟,薛羽.低温共烧陶瓷微波多芯片组件[J].电子学报,2002,30(5):711-714. 被引量:23

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