SMT回流焊温度测试仪的设计

Design of Temperature Instrument of Reflow Soldering in SMT

在表面组装技术中,炉温测试对于检测和监控回流焊质量是极其重要的,回流焊温度测试仪就是检测温度变化曲线的设备。本文设计的回流焊温度测试仪由现场单片机控制的测试系统和上位微机组成。现场单片机控制的测试系统对温度进行采集和处理,并通过串口发送给微机,由微机实现数据分析、曲线显示和打印。实验结果表明,该测试仪能够准确地测出回流焊温度。

In Surface Mounted Technique （SMT）, temperature detection of reflow soldering oven is important to inspect and control the quality of soldering. Reflow soldering temperature instrument is a mean to detect the temperature. In this pa per,we design an instrument that consists of a detection system controlled by single chip microprocessor and a computer, The temperature is sampled and converted into data in detection system,and these data are transferred to computer through series port. Temperature curves are analyzed,displayed or printed by computer. Practical results show this instrument can detect the temperature of reflow soldering oven exactly.