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溅射沉积Ni-Mn-Ga薄膜的研究进展 被引量：1

The Development of Sputtering Deposited Ni-Mn-Ga Thin Films
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摘要 以Ni-Mn-Ga为主要代表的铁磁形状记忆合金(FSMAs)不但具有传统形状记忆合金受温度控制的热弹性形状记忆效应,而且具有受磁场控制的铁磁形状记忆效应。微机电系统(MEMS)的应用要求Ni-Mn-Ga合金必须制备成薄膜的形式。对溅射沉积Ni-Mn-Ga薄膜的制备工艺进行了回顾与总结,对薄膜的各种性能特征和影响因素进行了详细的叙述,最后介绍了溅射沉积Ni-Mn-Ga薄膜的应用状况和应用趋势。 The ferromagnetic shape memory alloys（FSMAs）such as Ni-Mn-Ga alloys is a new type of intelligent material that has both conventional thermal shape memory effect and magnetic shape memory effect which is due to a magnetic field-induced rearrangement of martensitic variants. In order to be applied in the MEMS field, Ni-Mn Ga alloys have to be in the form of thin films. In this text, the magnetron sputtering technologies of Ni-Mn-Ga thin films are introduced and then the relationship between the film performance and the corresponding affection factors are explained. At last the applications and future trends are introduced.
作者 孙景文 李长生 李俊茂 姚固文 姜春华
机构地区 江苏大学机械工程学院
出处 《材料导报》 EI CAS CSCD 北大核心 2006年第F11期326-329,共4页 Materials Reports
关键词 磁控溅射 Ni—Mn-Ga薄膜 铁磁形状记忆合金 MEMS magnetron sputtering, Ni-Mn-Ga thin films, FSMAs, MEMS
分类号 TB381 [一般工业技术—材料科学与工程]
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参考文献22

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材料导报
2006年 第F11期

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