雾化介质对SnAgCu系无铅焊锡雾化粉末特性的影响

Influences of Atomizing Medium on the Properties of Free-lead Solder Powders of Sn-Ag-Cu System

实验利用自行设计的超音速雾化制粉装置,研究了不同雾化介质对SnAgCu系无铅焊锡粉末有效雾化率、粒度分布及球形度的影响。结果表明:在一定雾化条件下,氦气雾化粉末具有最高的有效雾化率、良好的粒度分布,且球形度最好;氮气雾化的粉末具有较好的综合性能;与氦气、氮气相比,氩气雾化粉末综合性能较差;空气雾化粉末雾化率较高,但粉末较粗、表面粗糙。

By utilizing supersonic atomization that is designed by ourselves, the study studies the influences of atomizing medium on the properties of free-lead solder powders of SnAgCu system： efficient atomization efficiency, size distribution and degree of sphericity. The results show that the free-lead solder powder is best in the efficient atomization efficiency, size distribution and degree of sphericity with helium as the atomizing medium. The combined property of the powder is better with nitrogen as the atomizing medium. With argon as the atomizing medium, combined property of the powder is inferior to that with nitrogen and helium as the atomizing medium. With air as the atomizing medium, the powder is better in the efficient atomization efficiency, but the panicles are coarser in size and rougher in surface