摘要
在电子元件的设计和电子封装的可靠性评估中焊点的热-机械可靠性是一个关键的因素。已经有许多疲劳模型提出和发展用于分析焊点在热-机械疲劳载荷下的可靠性问题。对这些模型进行了回顾,并对它们的应用和局限性作出了评价。
The thermal-mechanical reliability of solder joints has been a key issue in the design of electronic devices and the reliability assessment of electronic packaging. Numerous fatigue models have been proposed or developed for the evaluation of reliability of solder alloys under thermal-mechanics fatigue loading. A review of these models is presented here and their capabilities and limitations are identified.
出处
《机械设计与制造》
北大核心
2007年第1期76-78,共3页
Machinery Design & Manufacture
基金
浙江省高校科技创新基地资助
关键词
疲劳寿命模型
焊点
电子封装
Fatigue life model
Solder joints
Electronic packaging
