装配间隙对膨胀压差法扩散连接压力的影响

Influence of gap on diffusion stress in expansion stress diffusion bonding

利用有限元法模拟了QAl10-3-1.5柱和TC4环组合筒结构在连接温度850℃、连接时间60 min的工艺参数下进行扩散连接时装配间隙对扩散应力场的影响。结果表明:QAl10-3-1.5发生了明显的弹塑性变形,最大应力出现在QAl10-3-1.5柱和TC4环的接触处;间隙越大,产生的扩散应力越大,并且扩散连接应力p与间隙x间存在方程为p=118-1.46x的线性关系。

The numerical simulations of diffusion bonding of QA110-3-1.5 pole and TC4 loop assembled structure were carried out using finite element method under the condition of 850 ℃ and 60 min,and the influence of gap on the stress field was studied. The result shows that the apparent elastic-plastic deformation of QA110-3-1.5 pole occurs and the maximal stress emerges in joint region of QA110-3-1. 5 pole and TC4 loop. Furthermore, the diffusion stress increases with increasing the gap, and a linear relationship exists between the gap x and the diffusion stress p, which can be expressed by the function of p= 118- 1.46x.