摘要
介绍了硅材料本征载流子浓度ni、禁带宽度Eg、电子和空穴有效质量和及载流子迁移率μ的高温模型和计算结果。其中ni、Eg和、模型分别适用于300~1200K和300~700K,μ的模型在250~500K定温区及1013~1020cm-3杂质浓度范围内,最大误差小于13%。
In this paper, the high temperature models and calculation results of silicon materials' intrinsic carrier concentration m, energy gap Eg, effective mass of electron and hole as well as carrier mobility p are introduced. The models of ni .Eg and that of mn mp are suitable for use in the temperature range of 300 ̄1 200 Kand 300 ̄700 K, respectively. The error for p model is less than 13% in the condition of temperature range of 250 ̄500 K and doping range of 1013 ̄1020 cm-3.
出处
《固体电子学研究与进展》
CAS
CSCD
北大核心
1996年第4期344-347,共4页
Research & Progress of SSE
基金
国家自然科学基金
关键词
硅材料
物理参数
高温模型
Silicon Materials Physical Parameter High Temperature Model