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低温固化银系导电油墨导电性能的影响因素 被引量:5

Factors of effect on conductivity of low temperature cure silver ink
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摘要 为了提高低温固化银系导电油墨的导电性,对导电机理进行了研究。通过实验研究了聚合物分子结构,银粉的含量、形貌、粒径,溶剂种类对导电性能的影响。得出:氯化聚乙酸乙烯为主体树脂,以片状与球状混合银粉(质量比为9:1)为导电填料,并以酮和酯组成混合溶剂,调制的导电油墨导电性最好,其Rs达9 mΩ/□。 In order to increase conductivity of silver ink, the conductive mechanism was studied. Effects of the polymer molecular structure, the silver powder content, morphologies, particle size and solvent kinds on conductivity were studies. The results show that using the chlorinating polyvinyl acetate as the corpus resin, mixture of flaky silever powder and spherical silever powder ζ= 9:1 as filler, with the compound solvent, can produce a best electric conductive silver ink, Rs is 9mΩ/□.
出处 《电子元件与材料》 CAS CSCD 北大核心 2007年第1期33-35,共3页 Electronic Components And Materials
关键词 复合材料 银系油墨 导电性 薄膜开关 聚合物 composite material silver ink conductivity membrane switch polymer
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  • 1崔明明,刘成岑,施凯.石墨/炭黑对丙烯酸基水性导电油墨性能的影响[J].太原理工大学学报,2005,36(2):193-196. 被引量:8
  • 2熊胜虎,杨荣春,吴丹菁,郑东风,田民波.银粉形貌与尺寸对导电胶电性能的影响[J].电子元件与材料,2005,24(8):14-16. 被引量:28
  • 3郭顺松,骆仲泱,王涛,赵佳飞,岑可法.SiO_2纳米流体粘度研究[J].硅酸盐通报,2006,25(5):52-55. 被引量:14
  • 4李倩.导电油墨在RFID中的应用现状[J].今日印刷,2006(12):11-12. 被引量:1
  • 5李路海.印刷电子材料与技术发展趋势[R].北京印刷学院印刷包装材料与技术北京市重点实验室2007年度报告,2008,(3):24-27.
  • 6ALAN Rae,DANA Hammerfritzinger,Nano Dynamics Inc..Creating Metal and Nonmetal Nano-systems using Conductive Jettable Inks[J].Solid State Technology,2006,49(4):53.
  • 7BHAT S,MAITRA U.Facially Amphiphilic Thiol Capped Gold and Silver Nanoparticles[J].Journal of Chemical Sciences,2008,120(6):507-513.
  • 8LUECHINGER N A,ATHANASSIOU E K,STARK WJ.Graphene-Stabilized Copper Nanoparticles as an Air-Stable Substitute for Silver and Gold in Low-Cost Ink-Jet Printable Electronics[J].Nanotechnology,2008,19(44):445201.
  • 9KARWA A.Printing Studies with Conductive Inks and Exploration of New Conducting Polymer Compositions[J/OL].(2006-03-06)[2010-04-13].https:∥ritdml.rit.edu/ dspace/handle/1850/1318.
  • 10GELATOS A V,MARSH R,KOTTKE M,et al.Chemical Vapor Deposition of CooPer from Cu + 1 Pre-cursors in the Presence of WaterVapor[J].Applied Physics Letters,1993,63(20):2842-2844.

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