硬质合金上镀铜

Electroplating Cu on cemented carbide

在YG8硬质合金上得到了外观平整、质量较好的铜镀层。用扫描电镜(SEM)对镀层的表面形貌进行了分析,用加热法和划线法对镀层的结合强度进行了测试。结果表明:该镀层的表面显微硬度为216～219HV;预处理工艺对提高镀层质量有重要影响;H等离子处理改变了镀层和基体之间的结合状态,提高了镀层与硬质合金的结合强度。

A leveled copper deposit with good quality on YG8 cemented carbide was obtained. The surface morphology of the deposit was analyzed with SEM. The adhesion strength of the deposit was measured by heating method and scoring method. The results show that the micro-hardness of the deposit is 216 -219 HV; Pretreatment process has a significant influence on the deposit quality;H plasma treatment changes the bond state between the deposit and substrate, resulting in a improved adhesion of the deposit to cemented carbide.