基于正交试验的Cu-Ni-Si合金加工工艺研究

Research on aging technics of Cu-Ni-Si alloy basing upon normal design

利用L9(34)表对Cu-3.2Ni-0.75Si-0.3Zn合金的时效工艺进行了正交试验,结果发现,各因素对合金导电率和显微硬度影响程度的主次顺序分别为:时效温度>合金状态>时效后冷变形量>时效时间和时效温度>冷变形量>合金状态>时效时间。在保证合金性能不降低的情况下,该合金热轧板材经60%冷变形后,可直接进行时效而省去固溶处理。本试验所得合金的性能为:抗拉强度830MPa,显微硬度220Hv,导电率51%IACS,延伸率6%;同时材料厚度<0.120mm。

By Table L9（3^4） , normal experiment aging technics of Cu-3.2Ni-0.75Si -0. 3Zn alloy was conauctea. It was founded that, the primary and secondary sequence affecting electric conductivity and micro-hardness is： aging temperature〉alloy＇s state〉degree of cold deformation 〉aging time and aging temperature〉degree of cold deformation〉alloy＇s state〉aging time. The alloy can be straightly aged after 60% cold deformation without solution and the properties will not decrease. The properties obtained in this experiment are： tensile strength 830MPa, micro-hardness 220Hv, electric conductivity 51% IACS, elongation 6%; meanwhile, thickness is less than 0. 120mm.