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导电用超细铜粉防氧化新技术研究 被引量:1

Anti-oxidation Technique of Conductive Ultrafine Copper Powder
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摘要 利用自制的防氧化剂对已氧化超细铜粉表面改性,研究了氧化层去除和包覆工艺。结果表明,以5%硫酸作为酸洗剂,防氧化剂浓度为0.1%~0.5%,反应温度为60E,铜粉红外反射谱图中有防氧化剂特征峰,XRD和XPS玛分析结果表明,所得铜粉表面不含氧化物,防氧化剂在铜粉表面生成一层厚度适中的保护膜,隔绝了铜粉与环境的接触,不影响导电性,并且该保护膜在150℃以下以及5%H2SO4、5%NaOH和5%Naa溶液介质中稳定。 Oxidized copper powder was coated with an anti-oxidant which was self-made in the laboratory. The mechanism of the oxides removal from and the coating of the ultrafine oxidized copper power were investigated. IR,XRD and XPS analyses results showed that after pickled with 5 % H2SO4 and dipped in 0.1% -0.5 % anti-oxidant solution at 60℃ for a proper period of time, the surface of the powder was covered with a protective anti-oxidant film which will prevent the surface from environment attach,but don't affect the conductivity of the powder and the film is stable under 50℃ in 5% H2SO4,5%NaOH and 5% NaCl solutions.
出处 《材料开发与应用》 CAS 2007年第1期40-43,共4页 Development and Application of Materials
关键词 超细铜粉 防氧化 导电性 Ultrafine copper powder Oxidation resistance Conductivity
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