Sn-Cu-Ni-Ce钎料对激光钎焊焊点力学性能的影响

Effects of Sn-Cu-Ni-Ce solder on mechanical properties of micro-joints soldered with diode-laser soldering system

采用Sn-Cu-Ni-Ce无铅钎料,研究了半导体激光软钎焊和红外再流焊方法对QFP48器件和0805矩形片状元件两种典型元器件的钎焊性能,针对使用不同成分钎料所得到的钎焊焊点,采用微焊点强度测试仪研究了其焊点力学性能的分布规律。结果表明,使用Sn-Cu-Ni-Ce钎料时,最佳激光输出电流显著高于Sn-Ag-Cu钎料或Sn-Pb钎料。Sn-Cu-Ni-Ce钎料成分相同时,半导体激光软钎焊得到的焊点力学性能显著优于红外再流焊焊点的力学性能;稀土元素Ce的加入能够改善Sn-Cu-Ni无铅钎料焊点的力学性能,Ce含量达到0.03%时,焊点的力学性能最佳。

The properties of micro-joints of two kinds of components/devices QFP48 and rectangular chip component 0805 were studied with Sn-Cu-Ni-Ce lead-free solder by means of diode-laser soldering system and infrared reflow soldering method reflow soldering method,and the distribution regulations of the mechanical properties of quad flat packaging and rectangular chip component soldered with different compositional solders were tested and analyzed by STR-1000 micro-joints tester.The results indicate that optimal laser output current while soldering with Sn-Cu-Ni-Ce solder is obviously larger than that of soldering with Sn-Ag-Cu solder or Sn-Pb solder respectively.The mechanical properties of micro-joints soldered with laser soldering system is notability larger than that of micro-joints soldered with IR reflow soldering method.Adding rare earth element Ce to Sn-Cu-Ni lead-free solder is able to improve the mechanical properties of the micro-joints which the mechanical properties of micro-joints is the best when the content of Ce is about 0.03wt.%.