摘要
在等离子体化学气相沉积系统中采用高氢稀释硅烷蚀刻法制备了纳米硅薄膜。系统地研究了衬底温度对nc-Si:H薄膜的结构性能的影响。结果表明随着衬底温度从240℃升高到320℃,薄膜的晶态率从24%增大为65%,平均晶粒尺寸从6nm增大为10nm。当衬底温度≤200℃时,生成薄膜为a-Si:H薄膜。文中还对纳米硅薄膜的晶化机制进行了讨论。
Nanocrystalline silicon (nc-Si:H) films have been prepared by a glow discharge plasmachemical vapour debation(PCVD) system using heavily hydrogen(H2) diluted silane(SiH4). Theeffects of subotate temperature(Ts)on the structUre properties of nc-Si: H films have beensystematically. When the Ts increase from 240℃ to 320℃, the volume fration of the crystallinePhase of nc-Si:H fi:H films increases from 24% to 65% and the mean crystallite size from 6um to10um. When the Ts≤200℃,the deposited films are amorphous. The crystallization mechanism ofnc-Si:H film is discussed in this paper.
出处
《青岛化工学院学报(自然科学版)》
1996年第4期369-372,共4页
Journal of Qingdao Institute of Chemical Technology(Natural Science Edition)
关键词
硅薄膜
衬底
温度
晶化
纳米材料
薄膜
nanocrystalline silicon(nc-Si:H)films
substrate temperature
crystalliZation mechanism