丁二酮肟双核铜配合物与DNA相互作用的电化学研究

Electrochemical Studies on Interaction Between Dinuclear Copper(Ⅱ) Complex Containing Dimethylglyoxime and DNA

用电化学方法研究了丁二酮肟双核铜配合物[Cu2(Hdmg)4]与DNA的相互作用.考察了pH、温度、离子强度和配合物浓度等因素对配合物与DNA相互作用的影响,初步探讨了配合物与DNA相互作用的机理.实验结果表明,配合物与DNA的碱基结合形成非电活性物质,使溶液中游离配合物的浓度降低,配合物的峰电流减小.单链DNA(ssDNA)充分暴露的碱基使其与配合物的结合能力大于双链DNA(dsDNA).Cu2(Hdmg)4与ssDNA和dsDNA的结合比分别为2∶1和1∶1,结合常数分别为3.56×109和2.75×105.

Cyclic vohammetry was used to study the interaction between dinuclear copper（ Ⅱ ） complex containing dimethylglyoxime[ Cu2 （Hdmg）4 and DNA. The influences of pH, temperature, ionic strength and concentration of Cu2 （Hdmg）4 on the interaction were described, and the mechanism of the interaction was also discussed. The result shows that Cu2 （Hdmg）4 can interact with the bases of DNA to form non-electroactive complex, which can decrease the anodic peak current of Cu2 （Hdmg）4. The interaction between Cu2 （Hdmg）4 and ssDNA is stranger than that between Cu2 （Hdmg） 4 and dsDNA because of the exposed bases of ssDNA. The combining ratios of Cu2 （Hdmg）4 to ssDNA and to dsDNA are 2：1 and 1： 1, and the combining constants 3.56 × 10^9 and 2.75 × 10^5, respectively.