集成电路塑封模具常用计算公式及方法

Normal Calculation Formulas and Methods on IC Encapsulation Mold Filled with Multiple Ceramic Particles

随着国内集成电路封装行业的迅猛发展,高精度、高精密的封装模具作为主要设备,却长期依靠进口,增加了企业成本,这主要是国内模具供应商的设计制造能力不足,文章通过举例,详细介绍了模具型腔镶件的线涨匹配、上料框架线涨尺寸的计算等集成电路塑封模具常用的计算方法及公式,供大家参考。

With the rapid development of IC encapsulation industry in China, the exactness and precision encapsulation mold as the key equipment has been depended on import for a long time, the main reason is the domestic vendors be short of the skills of design and manufacture so that increased the purchase cost of IC encapsulation company. This article introduces the normal calculation formulas and methods on the liner expansion of cavity bar and L/F loader on the basis of examples for you reference.