贴片胶涂布工艺技术的研究

The Research of Surface Mount Adhesive Dispensing

贴片胶是SMT生产中重要的辅助材料,它被用来在波峰焊期间将表面贴装元件(Surface Mount Device,简称SMD)固定到电路板的焊接面上。文章简要论述了贴片胶的组成、特性、涂布方法、涂布设备、固化工艺及工艺优化问题,重点介绍了在各种工艺下环氧树脂和丙烯酸酯贴片胶的使用方法以及使用中出现的不良与对策,并给出了典型温度曲线以及温度曲线上主要控制点的工艺参数。

Surface mount adhesive is an important aid-materials in SMT application, it is used to curing SMD in soldering side of PCB during wave soldering. This article briefly describes it＇s construction, property, dispensing methods, dispensing equipments curing process and process optimization, among which emphasizes of the different using requirements in various construction processes for acrylate type and epoxy resin type surface mount adhesives. Moreover, some harmful tendencies and the way to deal with them in using processes were presented. The article introduces typical temperature profile and technical parameter of the main control point at the temperature profile.