摘要
简要阐述了高聚物阻尼材料的阻尼机理,综述了环氧树脂胶液的阻尼性能及其影响因素、纤维增强环氧树脂阻尼复合材料以及无机填料/环氧树脂阻尼复合材料的研究状况,指出了环氧树脂基阻尼材料的发展方向及前景。
Chief principle of polymer-based damping material was represented. The damping property of epoxy resin binder matrix, the fiber reinforced epoxy resin damping composites and the inorganic filler/epoxy resin damping composites were reviewed. The last part of the paper showed the prospective of epoxy resin based damping materials.
出处
《粘接》
CAS
2007年第1期47-50,共4页
Adhesion