摘要
研究了聚酰亚胺薄膜在不同碳化温度下,材料内部结构转变规律及其对材料性能的影响。研究结果表明,在温度区间500℃-650℃之间材料质量损失明显,达到28%;600℃材料开始向晶体结构转变,700℃逐渐衍生出类石墨结构;700℃左右材料力学和电学性能出现转折点,这正与材料结构的转变相呼应。
The changes of structure and its effect on performance of polyimide film have been studied at different carbonization temperature. The experimental results show that the weight of film decreases about 28% in a narrow temperature range（500℃～650℃）. The crystal structure of the sample starts to appear above 600℃ and the formation and growth of hexagonal carbon layers were observed above 700℃. The electrical property and mechanical properties have a transition around 700℃, which is consonant with structural conversion.
出处
《材料科学与工程学报》
CAS
CSCD
北大核心
2007年第1期115-117,101,共4页
Journal of Materials Science and Engineering
关键词
PI薄膜
碳化
结构
性能
PI film
carbonization
structure
property
