摘要
普通的激光打孔设备是采用固体激光器打小孔(孔径小于1mm),存在单次加工幅面范围小和加工材料厚度有限(材料厚度小于3mm)的缺陷。提出了一种利用大型二氧化碳气体激光加工设备来加工小孔的新型加工方式。实验结果表明,采用这种新型加工方式后,提高了单次加工幅面范围,并且能够在厚度达8mm的钢材上打出孔径等于0.8mm的小孔。此外,打孔的效率也明显提高。
In view of the defects of common solid-state laser while drilling small hole, such as the little area of single process and the limits of thickness of materials, a novel processing mode utilizing large carbon dioxide gas laser is presented. The experimental results show that the new processing mode can enlarge the area of single process, and the thickness of material processed is up to 8 mm. The laser drilling efficiency is greatly promoted at the same time.
出处
《光学与光电技术》
2007年第1期24-26,共3页
Optics & Optoelectronic Technology
关键词
小孔
单次加工
气体激光
small hole
single process
gas laser
