摘要
什么叫着“无题”？又为什么是“接着说……”呢？
出处
《印制电路信息》
2007年第2期3-5,共3页
Printed Circuit Information
同被引文献15
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1Tang Xiao-Feng, Yang Zhen-Guo, Wang Wei-Jiang. A simple way of preparing high-concentration and high-purity nano-copper colloid for conductive ink in inkjet printing technology[J]. Colloids and Surfaces A, 2010, 360(1-3):99-104.
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2Tai Yan-Long, Yang Zhen-Guo. Fabrication of paper-based conductive patterns for flexible electronics by direct-writing[J]. Journal of Materials Chemistry, 2011, 21(16):5938-5943.
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3Tai Yan-Long, Wang Ying-Xia, Yang Zhen-Guo, Chai Zhi-Qiang. Green Approach to Prepare Silver Nanoink with Potentially High Conductivity for Printed Electronics[J]. Surface and Interface Analysis, 2011,257:7096-7100.
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4Tai Yan-Long, Yang Zhen-Guo, Li Zhi-Dong. A Promising Approach to Conductive Patterns with High Efficiency for Flexible Electronics[J]. Applied Surface Science,2011,257, doi: 10.1016/ j.apsusc.2011.03.056.
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5Ji Li-Na, Gong Yi, Yang Zhen-Guo. Failure Investigation on Copper-plated Blind Vias in PCB[J]. Microelectronics Reliability, 2010, 50 (8): 1163-1170.
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6Ji Li-Na, Yang Zhen-Guo, Liu Jian-Sheng. Failure analysis on blind vias of PCB for novel mobile phones[J]. Journal of Failure Analysis and Prevention, 2008, 8(6):524-532.
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7Gu Yun-Song, Gong Yi, Yang Zhen-Guo. Hydrogen Embrittlement on High-speed Stainless Steel Belts Used for Tin Plating Chip Lead Frame. Journal of Failure Analysis and Prevention, 2010,10(5):399-407.
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8十七大报告辅导读本[B].北京:人民出版社,2007.12.
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9梅萌.加强产学研结合 促进科技创新[J].中国高校科技与产业化,2007(9):66-67. 被引量：4
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10林金堵.喷墨打印技术在PCB中的应用前景[J].印制电路信息,2008(4):8-13. 被引量：21
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1精彩瞬间[J].科技新时代（下半月）,2005(12):10-13.
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2杨承钧.无题[J].数码,2008(9):24-24.
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3郭静.浅析3G时期无线网络的发展与前景[J].科技资讯,2011,9(2):11-11. 被引量：1
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4凌霞.无题[J].数字通信,2006,33(5):2-2.
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5子衿.无题[J].新作文（初中作文指南）,2011(12):58-59.
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6诺基亚8800手机[J].新潮电子,2005(9):44-44.
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7徐登高,刘元震.CsI/Ni/LiF半透明真空紫外光阴极“日盲”效应的验证[J].真空科学与技术,1997,17(3):215-218. 被引量：1
