摘要
用有限元法计算了不同厚度铜片对Si3N4-4Cr10Si2Mo连接四点弯曲试样残余应力的影响,找出最大残余应力位置及数值。测量了不同厚度铜片作缓解层时连接试样强度。计算结果与测量结果一致性较好。当铜片厚度为0.3 mm时,连接试样残余应力最小,连接强度最高。
The influence of various copper foil thickness on the residual stress of the Si3N4-4Cr10Si2Mo joint was calculated by using finite element method. The position and value of the maximum residual stress were obtained. The joint strengths for different copper buffer layers were experimentally measured. The calculated and measured results are in good agreement. When the copper foil is 0.3 mm thick, the residual stress of joints reaches the minimum, resulting in the maximum joint strength.
出处
《真空电子技术》
2006年第4期31-33,共3页
Vacuum Electronics
