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双脉冲电位法制备铜镍层状结构材料

Electrodeposition of Cu-Ni Layered Films by Dual Potential Pulse Method
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摘要 采用旋转圆盘电极,用双脉冲电位法从简单的镀液中电沉积Cu-Ni层状材料。研究了镀液中铜含量、添加剂、转速对镀层的组成和结构的影响,并用扫描电镜和X-射线衍射研究了镀层的形貌和组成。结果表明:镀层由纯铜和含有少量铜的铜镍合金层交替组成;为了降低铜在镍层中的含量。可以采取降低镀液中铜含量和降低转速来实现。 A method has been developed to produce Cu-Ni composition-modulated alloys from a simple electrolyte by electrodeposition.The effects of the concentration of copper ions,additives and the speed of rotation were investigated.The results were analysed by SEM and X-ray diffraction.The result indicated that the film was alternating pure copper and copper-nickel alloy layers.If the content of copper in nickel layer is to be small, the concentration of its ions in solution must be small and the rotation speed must be low.
出处 《北京科技大学学报》 EI CAS CSCD 北大核心 1996年第5期482-485,共4页 Journal of University of Science and Technology Beijing
基金 冶金部腐蚀与磨损开放实验室资助
关键词 铜镍合金 层状结构材料 电镀 双脉冲电位法 electro-deposition, copper-nickel alloy, layer structure material
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