摘要
半导体制造技术已经达到了亚微米技术水平,CMP(chemical mechanical planarization)化学机械抛光是IC制造工艺中进行全局平坦化唯一的途径,分析了针对大直径晶圆进行全局平坦化,达到面型精度和表面完整性的要求而采取的区域压力控制技术。
At present, semiconductor manufacture technology has attained a sub-micron level, and CMP （chemical mechanical planarization） is the only approach of processing whole plainness in IC manufacture technics. Aiming at big-diameter wafer processed whole plainness, the paper analyses field pressure control technology of CMP system for attaining surface shape precision and surface integrality requirement.
出处
《电子工业专用设备》
2007年第1期58-61,共4页
Equipment for Electronic Products Manufacturing
